Nyomtatott áramköri kártyák gyártási technológiája:

Item	Process Capability
Material	FR4, Rogers, Alu-base, Rigid flex, High Tg.
Surface Treatment	Tin Lead / Leadfree HASL, Flash Gold, ENIG, OSP, Immerson Tin, Immerson Silver, Hard Gold
Selective Sufrace Treatment	ENIG + OSP, ENIG + Gold Finger, Flash Gold + HASL, Flash Gold + Gold Finger, Immerson Silver + Gold Finger, ImmersonTin + Gold Finger
Layer Count	1-32 layers
Min. finished size	10x10mm
Max. finished size (Doubled sides)	584x889mm
Max. finished size (ML4)	571x850mm
Max. finished size (ML6,8 ... etc)	571x673mm
Bow and Twist	0,7%
Finished Board Thickness	0,2-7,0 mm / < 0,5 mm for HASL
Finished Board Thickness Tolerance (< 1,0 mm)	+- 0,1mm
Finished Board Thickness Tolerance (> 1,0 mm)	Material Thickness +- 10%
Unspecified Finished Board Thickness Tolerance (No stack up requirements)	Multilayers: < 2,0mm +- 0,1mm, 2,0-3,0mm +- 0,15mm, 3,0mm +- 0,2mm Double Slides +- 10%
Flammability	94V-0
Copper foil	12, 18, 35, 70, 105,
Solder Mask Color	green, yellow, black, blue, red, white, matte green
Component Mark Color	white, yellow, black
Peelable mask thickness	0,2-0,5mm
Max. Gold Finger Lenght	2inch
Nickel Thickness for ENIG	3-5
Gold Thickness for ENIG	0,025-0,1
Nickel Thickness for Gold Finger	3-5
Gold Thickness for Gold Finger	0,25-1,5
Blind and Burried Vias, Impendance controlled, VIA plugging, BGA